北京激光切割加工技術(shù)應(yīng)用情況

　  激光是20世紀(jì)以來，繼原子能、半導(dǎo)體、計算機(jī)之后又一重大發(fā)明，技術(shù)潛力巨大，因此有專家認(rèn)為，未來將會由光技術(shù)時代取代電子技術(shù)時代，這光技術(shù)時代的主角將是激光。

　　當(dāng)今激光主要用于材料加工，這也是激光應(yīng)用最具有發(fā)展前途的方式，國外對于激光加工技術(shù)已經(jīng)開發(fā)出了二十多種。由于激光具有很好的空間控制性和時間控制性，對加工對象的材質(zhì)、形狀、尺寸和加工環(huán)境的自由度都很大，加之目前激光加工和計算機(jī)數(shù)控技術(shù)的完美結(jié)合已經(jīng)成為了最高效的自動化加工設(shè)備，也是企業(yè)生產(chǎn)的關(guān)鍵技術(shù)。

　　目前已經(jīng)成熟的激光加工技術(shù)有：激光存儲技術(shù)、激光去重平衡技術(shù)、激光快速成形技術(shù)、激光熱處理技術(shù)、激光焊接技術(shù)、表面處理技術(shù)、激光切割技術(shù)、激光劃線技術(shù)、激光蝕刻技術(shù)、激光微調(diào)技術(shù)、激光打孔技術(shù)、激光清洗技術(shù)和激光打標(biāo)技術(shù)等等。

　　激光切割加工技術(shù)主要用于金屬和非金屬材料之間的加工。采用激光切割加工技術(shù)不僅能有效提高加工效率，提高產(chǎn)品質(zhì)量，還能降低企業(yè)生產(chǎn)成本。常見的切割加工技術(shù)有脈沖激光加工和連續(xù)激光切割加工，前者適用于金屬材料，后者適用于非金屬材料，且后者使用最為廣泛，也是目前激光切割技術(shù)應(yīng)用最重要的領(lǐng)域。

　　說到激光加工，就不得不提到激光打孔技術(shù)，以前打孔都是選用硬度比打孔物質(zhì)高的物質(zhì)進(jìn)行打孔，效率低，遇到硬度大的例如金剛石之類的材料，想要完成打孔是很困難的。當(dāng)激光應(yīng)用在打孔技術(shù)上，無論多硬的物質(zhì)都可以輕而易舉的完成，而且激光打孔技術(shù)具有精度高、通用性強(qiáng)、效率高、成本低等優(yōu)點，唯一的缺點就是激光鉆出的孔是圓錐形的，而不是機(jī)械鉆孔的圓柱形。

Laser since the 20th century, following the atomic energy, semiconductor, computer after another major inventions, technology has great potential, so some experts believe that the future will be replaced by the era of electronic technology light technology era, the protagonist of this era of optical technology is the laser.

Today mainly used for laser material processing, laser applications, this is the most promising way abroad for laser processing technology has been developed over twenty kinds. Because the laser has a good controllability and time controlled space, the object of processing materials, shapes, sizes and degrees of freedom are large processing environment, coupled with the current laser processing and computer numerical control technology has become the perfect combination of the most efficient automated processing equipment, but also the production of key technologies.

Now mature laser processing technologies: laser storage technology, laser technology to re-balance, laser rapid prototyping technology, laser treatment, laser welding technology, surface treatment technology, laser cutting, laser marking, laser etching technology, laser trimming techniques, laser drilling, laser cleaning technology and laser marking technologies.

Laser cutting technology is mainly used for metal and nonmetal materials processing between. Laser cutting technology can not only effectively improve processing efficiency, improve product quality, but also reduce production costs. Common cutting technology and continuous pulse laser processing laser cutting, the former applies to metallic materials, which applies to non-metallic materials, and the latter the most widely used, is currently the most important applications of laser cutting technology areas.

Speaking of laser processing, laser drilling techniques have to mention previously perforated punch substances are optional higher hardness than substance punch, low efficiency, encounter great hardness of a material such as diamond, you want to punch is very difficult to complete. When the laser used in drilling technology, no matter how hard the material can be easily completed and laser drilling technique with high accuracy, versatility, high efficiency, low cost, and the only drawback is that the laser-drilled hole conical, cylindrical rather than mechanical drilling. 

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